Nexscien Co., Ltd.

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Model Number

YIT-4510

1. Unit Type Test (Possible to Test Before and After Ball Attach)

2. Applied Tray’s Auto Loading/Unloading

3. High UPH Realization by Continual Loading Method

4. Possible to respond to various Size of Package (Conversion Kit Change)

5. Flow and Contact Type that don’t give a shock to Device and Solder Ball

6. Possibility of Precise Control by Motor when Test Contacting

(Contact Focus Control)

7. Possible to multipoint Channel Test like 2560Pin

8. Reject is easy to manage and pick by using Tray

10. Able to display faulty point and measurement value of test in the program

11. Easy change kit

- Loading & Unloading Picker - Dut Board & Socket

12. Pentium Pc control with GUI

ITEM	DESCRIPTION	SPECIFICATION
HANDLER	TARGET PACKAGE SIZE	PKG UNIT ; PBGA, SBGA, ETC
	PARALLELISM	1Parallelism (Dual Head)
	INDEX TIME	UNIT ; 3 sec/unit (Test Time ; 1sec)
	THROUGHPUT (UPH)	1200 unit/hour (Test Time 1sec)
	CONTACT METHOD	Pogo, Rubber
	CHANGE OVER TIME	About 20 min
	TRAY	JEDEC TRAY
	BINS	GOOD Tray
	BINS	Reject Tray For Reject Device
	INTERFACE METHOD	ISA Bus
	POWER	AC220V ±10%, 1PHASE, 50/60Hz
	AIR PRESSURE	4~6 ㎏/㎠
	DIMENSION	1850(W) x 1350(D) x 1620(H)
	OPTION	VISION, ETC…
TESTER	TESTER MAKER	Nexscien TESTER (Model ; YOst02B)
	TEST ITEM	OPEN, SHORT TEST
	TEST TIME	About 1 sec ( Max 2,560 pin )